The table shows the most important and most frequently observed values of basic materials for the production of printed circuit boards. Other values can be found in our own technical specifications for individual materials. Description of the variables is provided below the table.
| Type of material / Value (unit) |
Tg (°C) |
T260 (min) |
T288 (min) |
TD (°C) |
CTE (ppm/K) |
CTI (V) |
ε (F/m) |
DB (kV) |
TST |
IPC-4101 |
| Isola E-Cu quality 104 KF |
135 |
60 |
- |
310 |
53 |
400 |
4,37 |
45 |
NO |
IPC-4101-/21 |
| VENTEC VT-47 |
180 |
>60 |
>30 |
355 |
45 |
175-250 |
4,27 |
60 |
NE |
IPC-4101E/97/98/99/101/126 |
| PANASONIC R-1566s |
175 |
60 |
10 |
355 |
40 |
> 600 |
4,7 |
- |
NE |
IPC-4101-/130 |
| ASTRA MT77 |
190 |
>60 |
>60 |
360 |
50-70 |
175-250 |
3,0 |
45,4 |
NO |
IPC-4103-/17 |
| I-Tera MT40 |
200 |
>60 |
>60 |
360 |
55 |
175-250 |
3,45 |
45,4 |
NO |
IPC-4103-/17 |
| Rogers RO4350B |
280 |
> 60 |
> 10 |
390 |
46-50 |
> 600 |
3,48 |
31 |
YES |
IPC-4103-/11 |
| VENTEC VT-901 |
260 |
>60 |
>60 |
390 |
50 |
100-175 |
4,15 |
60 |
NO |
IPC-4101-/40/41/42 |
| Pyralux AP |
195-220 |
60 |
> 10 |
390 |
25 |
175 |
3,4 |
150 |
NO |
IPC-4204-/11 |
| Epoflex |
220 |
- |
- |
390 |
25 |
175 |
3,5 |
- |
NO |
IPC-4202-/2 |
| Tg (°C) : |
glass transition temperature |
| T260 (min) : |
time to delamination at 260 °C |
| T288 (min) : |
time to delamination at 288 °C |
| TD (°C) : |
thermal decomposition temperature |
| CTE (ppm/K): |
Coefficient of Thermal Expansion in the z-axis |
| CTI (V) : |
Comparative Tracking Index |
| ε (F/m): |
Permittivity |
| DB (kV): |
Dielectric Breakdown |
| TST: |
Thermal Stress Test |
| IPC-4101: |
material category |
examples of the use of basic materials
| Isola E-Cu quality 104 : |
standard industrial and consumer electronics used in non-aggressive environment. |
| Isola E-Cu quality 104KF : |
for products in a highly humid to wet environments, such as washing dishes or cleaning machines. Wherever resistance is required creeping currents. |
| Isola IS400 : |
ideal for multi-layer PCB; the automotive industry; fine structure; environment with a higher temperature |
| Isola PCL370HR : |
combines high thermal resistance and low expansion in the "Z". Ideal for multi-layer PCB with fine structures |
| NANYA UV BLOCK FR-4-86 : |
standard industrial and consumer electronics used in non-aggressive environment. |
| Rogers RO4350B : |
high-frequency material (up to 10 GHz) for the production of sensitive equipment (satellite broadcasting, ERS amplifiers, antennas ...) |
| VENTEC VT-901 : |
highly heat resistant material for testing and test equipment, military industry, commercial or industrial electronics applications that require high reliability at high temperatures |
| Pyralux AP : |
this material is ideal for multilayer flex and rigid-flex applications that require special demands on flexibility, thermal resistance and high reliability. |
| Epoflex : |
similar to using a Pyralux AP. |
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