Special holes

 

1. Through-vias

Assembly holes, component pin holes and through-via penetrate all layers of a multilayer PCB. The diameter of THT holes bigger than 0.5mm are normally increased due to the plating thickness of about 0.1mm. VIAs with diameter smaller than 0.5 mm are typically not enlarged - their size depends on the size of drill pad and the restring, unless otherwise indicated.

The smallest holes determines the drilling depth ( T - B )

Hole diameter (mm) 0,2 0,25 0,3 0,35 0,4 0,5
Maximum depth (mm) 1,2 1,5 1,8 2,1 2,4 3,0

 

2. Blind vias

Blind vias have always contact to an outer layer and to one or several inner layers

The smallest holes determines the drilling depth ( T - I... ) or ( B - I...

Hole diameter (mm) 0,25 0,3 0,35 0,4
Maximum depth (mm) 0,25 0,3 0,35 0,4

 

3. Buried vias

Buried vias connect two or more innerlayers and never have any contact to an outer layer

The smallest holes determines the drilling depth ( I... - I... )

Hole diameter (mm) 0,2 0,25 0,3 0,35 0,4
Maximum depth (mm) 1,2 1,5 1,8 2,1 2,4

 

4. Plated or Non-plated slots

Special plating holes and slots performed directly on routing machine through slot drill diameter 0.6 to 2.4 mm or milling. For plating cutouts use a separate gerber layer showing borderline shaped cutout thin line or directly milling file. The middle line indicates the slot size. Data can also enter through the drilling of the file where you specify a separate "T" tool edge position of the groove. Technology plated cutouts highlight please your order.

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