Isola PCL370HR

The demands relating to the reliability of printed circuit boards are increasing. Major influences besides the actual layout and design are the thermal attributes of the base material such as the glass transition temperature (Tg), time to delamination at 260 °C (T260) and 288 °C (T288) thermal decomposition temperature (TD) and the thermal expansion behaviour in the z-axis. In many cases the reliability of printed circuit boards is determined by destructive tests, especially in automobile applications.

High thermal resistance : Tg = 170 °C ( FR4 Tg = 135 °C )
Low z-axis expansion : Alfa z = 35-40 ppm / K @ RT-120 °C ( FR4 Alfa z = 70-280 ppm )

 

Basic material on stock : ISOLA PCL370HR:

material (mm)/thickness Cu (µm) 18/18 35/35 70/70 105/105 0/35 0/70 0/105
0,05
0,065
0,1
0,125
0,15
0,2
0,25
0,3
0,36
0,41
0,51
0,71
1,0
1,2
1,5
2,0
2,4

 

prepreg 106 50µm
prepreg 1080 65µm
prepreg 2116 113µm
prepreg 7628 175µm

 

Cu foil 9,12,18,35,70 a 105µm

 

 material on stock in PragoBoard s.r.o.
  material only per order ( delivery 14 working days )
  Technical specification - ISOLA PCL370HR

 

Comparison of technical characteristics of the material PCL370HR with other materials ISOLA

  company adress :
Žateckých 1532/7
140 00 Praha 4, Česká republika
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  place of business :
Technologický park Běchovice
190 11 Praha 9, Česká republika
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