The demands relating to the reliability of printed circuit boards are increasing. Major influences besides the actual layout and design are the thermal attributes of the base material such as the glass transition temperature (Tg), time to delamination at 260 °C (T260) and 288 °C (T288) thermal decomposition temperature (TD) and the thermal expansion behaviour in the z-axis. In many cases the reliability of printed circuit boards is determined by destructive tests, especially in automobile applications.
High thermal resistance : Tg = 170 °C ( FR4 Tg = 135 °C )
Low z-axis expansion : Alfa z = 35-40 ppm / K @ RT-120 °C ( FR4 Alfa z = 70-280 ppm )
Basic material on stock : ISOLA PCL370HR:
| material (mm)/thickness Cu (µm) | 18/18 | 35/35 | 70/70 | 105/105 | 0/35 | 0/70 | 0/105 |
| 0,05 |  |
 |
|
|
|
|
|
| 0,065 | |
|
|
|
|
|
|
| 0,1 | |
|
|
|
|
|
|
| 0,125 | |
|
|
|
|
|
|
| 0,15 | |
|
|
|
|
|
|
| 0,2 | |
|
|
|
|
|
|
| 0,25 | |
|
|
|
|
|
|
| 0,3 | |
|
|
|
|
|
|
| 0,36 | |
|
|
|
|
|
|
| 0,41 | |
|
|
|
|
|
|
| 0,51 | |
|
|
| |
|
|
| 0,71 | |
|
|
|
|
|
|
| 0,80 | |
|
|
|
|
|
|
| 1,0 | |
|
|
| |
|
|
| 1,2 | |
|
|
| |
|
|
| 1,5 | |
|
|
| |
|
|
| 2,0 | |
|
|
| |
|
|
| 2,4 | |
|
|
| |
|
|
| prepreg 106 | 50µm |
| prepreg 1080 | 65µm |
| prepreg 2116 | 113µm |
| prepreg 7628 | 175µm |
| Cu foil | 9, 12, 18, 35, 50, 70, 105, 210, 400µm |
| material on stock in PragoBoard s.r.o. material only per order ( delivery 14 working days ) |
 Technical specification - ISOLA PCL370HR
|
Comparison of technical characteristics of the material PCL370HR with other materials ISOLA
